TSA series/TSE-12/TSD-101
TSA series
Thermal shock without moving test specimens
TSA series is designed to evaluate reliability of test specimens by rapid change of the air temperatures from hot to cold repeatedly by opening and closing of damper in a single test area. You can get accurate test results without any mechanical impact on test specimens because a test area does not move. Fixed test area type can save testing time because transfer time of the specimen from one chamber to the other is not necessary, also suitable for testing large size, heavy specimens and/or testing many small devices at one time.
Highly accurate temperature recovery
The conditioned air is pre-cooled or pre-heated beyond the setpoint, allowing quicker recovery of the desired condition.
Easy access to specimens
Wiring to specimens is simple and easy, also the cables are supported and secured in its position because the test area does not move. Monitoring and data acquisition of test specimens is easy through cable port, too.
TSE-12
Optimized size for low-volume testing
The compact thermal shock chamber answers to the need for small or low-volume specimens testing. Featuring a wide test area in a slim design, the TSE chamber offers high performances that meet severe test requirements.
Quick temperature recovery
The two zone test system (+150°C to -65°C) achieves temperature recovery time of less than 5 min, without auxiliary cooling.
Meeting International Standards
The TSE chamber achieves various tests from major international standards such as MIL, JIS…
TSD-101
Uniform thermal stress performances
The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the field of research, development, inspection, and production.
Meeting International Standards
TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.
Reduced power consumption
Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.
Energy Efficient Design
Network solutions
Control and monitor your chamber on-site or remotely,edit and transfer programs from one chamber to another,and receive email alerts even on your mobile.
Compatible test standards
IEC 60749-25 |
Semiconductor devices – Temperature cycling |
IEC 60068-2-14 Na |
Environmental testing – Change of temperature |
IEC 61747-5 |
Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods |
MIL-STD-883 |
Military standard, microcircuits, test standards |
IPC-TM-650 2.6.6 |
Temperature cycling, printed wiring board |
SAE J1879 |
Handbook for robustness validation of semiconductor devices in automotive applications |
JASO-D902 |
Durability testing methods for automotive electronic equipment |
EIAJ ED-4701 |
Environmental and endurance test methods for semiconductor devices. (General) |
EIAJ ED-4702 |
Mechanical stress test methods for semiconductor surface mounting devices |
EIAJ ED-7407 |
Environmental and endurance test methods for CSP, BGA package on mounting condition |
Series |
Model |
Temperature range |
Inside dimensions (mm) |
TSA |
TSA-43EL |
High temp. exposure: |
W240×H460×D370 |
TSA-73EL |
W410×H460×D370 |
||
TSA-103EL |
W650×H460×D370 |
||
TSA-203EL |
W650×H460×D670 |
||
TSA-303EL |
W970×H460×D670 |
||
TSA-73ES |
High temp. exposure: |
W410×H460×D370 |
|
TSA-103ES |
W650×H460×D370 |
||
TSA-203ES |
W650×H460×D670 |
||
TSA–73EH |
High temp. exposure: |
W410×H460×D370 |
|
TSE |
TSE-12-A |
High temp. exposure: |
W320×H148×D230 |
TSD |
TSD-101-W |
High temp. exposure: |
W710xH345xD410 |