Dip Tester
DS-10S
- Solder Temp. Sensor
Special Feature for DS-10S
The sensor part with a small heat capacity accurately measure the solder temperature and atomosphere of the device.
- Dip Time Sensor
Detect electrical continuity and measure solder contact time.
- Pre-heat Sensor
Temperature sensor temperature rise and peak measurement in the sensor board allows relative control of the device state.
- Measurement of Moving Speed
Measure the size of the nozzle by scanning X and Y on two dip time sensors.
- Profile Measurement
Perform various management such as OK/NG
judgment and data analysis.
- DS-10S Software
Perform various management such as OK/NG judgment and data analysis.
(Pre-heat temp. Dip time, Solder temp.
X-Y speed, Solder size X, Y and etc.)
General Specifications
|
Items |
|
|
Cold contact point compensation |
Compensation with platinum temp. measuring resistor |
|
Ambient temp |
150℃ 5minutes max |
|
External connection |
USB（miniB connector） |
|
Number of memory |
1 (Max5 solder stage) |
|
Sampling time |
50ms（fix） |
|
Outer dimensions・weight |
78mm(D)X214mm(W)×43.6mm(H) ・ 820g |
|
Power supply |
AAA batteries x 2pcs |
Measurement Data Specifications
|
Items |
Sensor |
Display |
Measurement range |
Accuracy |
|
Solder temp. |
K-type shath thermocouple |
Degital LCD 3digit |
0～330℃ |
±1℃ |
|
PCB lower sarfce temp. |
k-type thermo couple |
0～330℃ |
±1℃ |
|
|
Dip time |
Electrode(2pcs.) |
0～10sec. |
||
|
X,Y axis moving speed |
Electrode(8pcs.) |
0～20mm/sec. |
||
|
X,Y axis solder size |
Electrode(8pcs.) Calucurate from the moving speed & contact time to the electrodes |
0～35mm |
±0.2 |
|
|
Temp.profile |
Preheat・Solder temp. |
PC software |
0～330℃ |
±1℃ |
