X-ray Inspection systems

Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes

Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy failure analysis – resulting in substantial cost-savings compared to micro sectioning

Automatic void calculation with VoidInspect CL or DR, the laminography- or radiscopy-based inspection workflows enabling the rapid non-destructive analysis of voids inside the solder joints of board components

THTInspect DR, the semi-automated defect analysis for fill level inspections on THT-based components in 2D

Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection systems

Optional high load capacity (< 20 kg) with reinforced table and mechanics: Several parts and electronic interconnects in fixed packages can be inspected at once – a real-time saver

Cheetah EVO SMT applications

• PCB
  • BTC
  • BGA
  • LGA
  • QFN/QFP
  • THT
• IGBT
• LED

Semicon inspections: maximum resolution at minimum voltage

• Highly sensitive detector with optional low dosage mode
• High detail recognition through an integrated image chain
• Integrated, automatic defect detection with FGUI (e.g. voids in bumps)